Radiation-induced alterations in SnAg3Cu0.5 solder joint

This study aims to examine the effect of a broad dose range of gamma irradiation on the eutectic microstructure and micromechanical properties of solder joint. The mechanical properties including hardness, reduced modulus, and creep behaviour (soldered alloys) using nanoindentation. The SnAg3Cuo.5 (SAC305) solder paste for soldering was stencil-printed onto the surface of the printed circuit board to create the solder joint and reflow soldering, and was then exposed to a wide range of gamma radiation doses (from 5 to 50000 Gy). After the exposure, the samples undergo metallographic procedure prior to the indentation test. The hardness, intermetallic compound (IMC) thickness, also phase area before and after irradiation were observed via optical microscope and analysed via ImageJ. It was discovered that gamma exposure could alter SAC305 behaviour. During the 5000 Gy exposure, atomic displacement and transmutation products led to plastic deformation, resulting in increasing in hardness. Increased depth relative to length of stay correlates with an increase in radiation. Stress exponential outcomes produce a mixture of outcomes when the dose is increased. 500 Gy is the highest reduced modulus value. The increase in reduced modulus followed the increase in gamma radiation, according to the research. Gamma radiation altered the microstructure of SAC305 solder resulting a change in IMC thickness as the radiation increased. The phase area was analysed for SAC305 by using ImageJ. The eutectic phase area showed a parallel trend to the hardness value obtained. It was found that C116Sns and AggSn compounds dominated the intermetallic layer in the Sn matrix.